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Glass Passivated Chip Junction Miniature Surface Mount Bridge Rectifier FUXINSEMI MB10S 1000V Voltage

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Glass Passivated Chip Junction Miniature Surface Mount Bridge Rectifier FUXINSEMI MB10S 1000V Voltage

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Model Number :	MB10S

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Glass Passivated Chip Junction Miniature Surface Mount Bridge Rectifier FUXINSEMI MB10S 1000V Voltage

Product Overview

The Fuxinsemiconductor MB05S thru MB10S series are 0.8A Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers, offering voltage ratings from 50V to 1000V. These rectifiers are designed for space-saving on printed circuit boards and are ideal for automated replacement. They feature reliable, low-cost construction with molded plastic technology and glass-passivated chip junctions. Lead-free parts meet RoHS requirements, with a "-H" suffix indicating Halogen-free options.

Product Attributes

Brand: Fuxinsemiconductor
Construction: Molded plastic technology, Glass passivated chip junctions
Certifications: Lead-free parts meet RoHS requirements. Suffix "-H" indicates Halogen free part.
Flame Retardant: UL94-V0 rated epoxy
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Marked on body
Mounting Position: Any

Technical Specifications

Symbol	Description	MB05S	MB1S	MB2S	MB4S	MB6S	MB8S	MB10S	Unit
VRRM	Maximum Recurrent Peak Reverse Voltage	50	100	200	400	600	800	1000	V
VRMS	Maximum RMS Voltage	35	70	140	280	420	560	700	V
VDC	Maximum DC Blocking Voltage	50	100	200	400	600	800	1000	V
I(AV)	Maximum Average Forward Rectified Current @TJ=25	0.8							A
IFSM	Peak Forward Surge Current 8.3ms Single Half Sine-Wave Super Imposed on Rated Load (JEDEC Method)	30							A
VF	Maximum Forward Voltage at 0.8A DC	1.1							V
IR	Maximum DC Reverse Current @TJ=25 at Rated DC Bolcking Voltage	500							A
IR	Maximum DC Reverse Current @TJ=125 at Rated DC Bolcking Voltage	10							mA
I2t	I2 t Rating for Fusing(t<8.3ms)	15							A2s
CJ	Typical Junction Capacitance Per Element(Note1)	85							pF
RJA	Typical Thermal Resistance (Note2)	3.74							/W
TJ	Operating Temperature Range	-55 to +150
TSTG	Storage Temperature Range	-55 to +150

Note 1: Measured at 1.0MHz and applied reverse voltage of 4.0V DC.

Note 2: Thermal resistance from junction to ambient mounted on P.C.B with 0.5*0.5"(13*13mm)copper pads.

Package Dimensions (MBS)

Symbol	Dimensions in inches and (millimeters)
A	0.023 (0.58)
B	0.030 (0.76)
C	0.070 (1.78)
D	0.226 (5.75)

Marking:

MB05S
MB1S
MB2S
MB4S
MB6S
MB8S
MB10S

Halogen Free Marking: Suffix "-H" indicates Halogen free part, e.g., MB05S-H.

2011091106_FUXINSEMI-MB10S_C915623.pdf

Glass Passivated Chip Junction Miniature Surface Mount Bridge Rectifier FUXINSEMI MB10S 1000V Voltage

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