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Glass Passivated Chip Junction Bridge Rectifier Molded Plastic Technology FUXINSEMI GBU2510 Lead Free

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Glass Passivated Chip Junction Bridge Rectifier Molded Plastic Technology FUXINSEMI GBU2510 Lead Free

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Model Number :	GBU2510

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Glass Passivated Chip Junction Bridge Rectifier Molded Plastic Technology FUXINSEMI GBU2510 Lead Free

Product Overview

The Fuxin GBU series of Glass Passivated Single Phase Bridge Rectifiers are designed for non-automatic applications, offering space-saving benefits on printed circuit boards. They are ideal for automatic insertion and feature a reliable, low-cost construction utilizing molded plastic technology. These rectifiers are built with glass-passivated chip junctions and lead-free parts that meet RoHS requirements. The series is suitable for various power applications requiring efficient rectification.

Product Attributes

Brand: Fuxin
Construction: Molded plastic technology
Chip Junctions: Glass passivated
Compliance: Lead-free parts meet RoHS requirements
Suffix "-H": Indicates Halogen free parts
Epoxy: UL94-V0 rated flame retardant
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Marked on body
Mounting Position: Any

Technical Specifications

SYMBOL	GBU25005	GBU2501	GBU2502	GBU2504	GBU2506	GBU2508	GBU2510	UNITS
V_RRM	50	100	200	400	600	800	1000	V
V_RWM	50	100	200	400	600	800	1000	VDC
V_RMS	35	70	140	280	420	560	700	V
I_F(AV) Note 1 @T_A=90C	25.0							A
I_FSM Rating for fusing (t <8.3ms)	200							A
I₂t Rating for fusing (t <8.3ms)	1.2							A²s
V_FM per element @I_F=12.5A	1.1							V
V_FM per element @I_F=25A	350							mV
I_R @ Rated DC Blocking Voltage @T_J=25C	5.0							uA
I_R @ Rated DC Blocking Voltage @T_J=125C	200							uA
C_J Note 2	20							pF
R_JA	35							C/W
R_JC	5.0							C/W
R_JL	50							C/W
V_IDS Dielectric Strength	2500							V
T_{J,T_STG}	-55 to +150							C
Proposed installation torque	5.0							Kgf.cm
Max torque	8.0							Kgf.cm

Notes:
1. Mounted on glass epoxy PC board with 1.3mm solder pad.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.

Soldering Condition

Reflow soldering

Parameter	Value	Unit
Preheat - Temperature Min (T_smin)	150	C
Preheat - Temperature Max (T_smax)	200	C
Preheat - Time (t_smin to t_smax)	60~120	sec
Ramp-up Rate (T_smax to T_P)	<3	C/sec
Time maintained above T_L	217	C
Time (t_L)	60~260	sec
Peak Temperature (T_P)	255	C
Time within 5C of actual Peak Temperature (t_P)	10~30	sec
Ramp-down Rate (T_P to 25C)	<6	C/sec
Time 25C to Peak Temperature	<6	minutes

Storage environment: Temperature=5 ~40 C, Humidity=55%25%

2010151636_FUXINSEMI-GBU2510_C880916.pdf

Glass Passivated Chip Junction Bridge Rectifier Molded Plastic Technology FUXINSEMI GBU2510 Lead Free

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